Heating: Via a liquid carrier thermostat

The process of heating the walls of the mold to a high temperature is carried out by thermostating water under
pressure with a temperature of up to 200 ° C.
The hot coolant is pumped through the thermostating channels located near the cavity until the desired temperature of the mold walls is reached and the injection process is switched on by the sensor sensors.

Cooling: Via a liquid carrier thermostat

The mold walls are cooled by pumping water through a highly efficient thermostat heat exchanger and a low outlet temperature. Thus, an intensive and short cooling phase is provided. The beginning of the cooling phase is initiated by a signal from the TYPE.
After the end of the cooling phase, the mold opens and a new heating phase begins for the next cycle.

The energy buffer of the formative is controlled by a microprocessor

The heating and cooling phases are changed through a valve located next to the forming one. The disadvantage
of classical thermostats, manifested in the release of a large amount of energy as a result of the change of heating and
cooling phases, can be eliminated by using new thermostats that regulate energy storage. The ESR
accumulates a variable amount of heat and releases it into the process when the temperature level changes. The energy buffer is controlled by a microprocessor, which automatically adapts to the number of cycles and the size of the mold.